TLDR
- SK hynix rebounds 1.98% overnight after a 0.70% drop to $142.72 at Tuesday’s close.
- SK hynix and Sandisk unveil the first open industry standard for HBF technology.
- HBF targets AI storage bottlenecks with 512GB capacity and speeds up to 3.0TB/s.
- Google and Tenstorrent back the consortium as SK hynix expands HBF adoption.
- SK hynix previews 375-layer NAND with 2.5 times better performance per watt.
SK hynix shares fell 0.70% to $142.72 before rebounding 1.98% overnight to $145.55. The recovery followed new details on its High Bandwidth Flash partnership with Sandisk. The companies introduced an open standard aimed at improving storage performance across modern data centers.
SK hynix and Sandisk Set High Bandwidth Flash Standard
SK hynix and Sandisk unveiled the first standard specifications for High Bandwidth Flash technology. The announcement came during FMS 2026 in Santa Clara, California. Their work targets growing data demands created by larger inference workloads and complex computing systems.
High Bandwidth Flash sits between high-bandwidth memory and solid-state drives. It combines faster data movement with larger storage capacity through NAND technology. Therefore, the design could support systems that require both speed and expanded capacity.
The partners began formal standardization work in August 2025 and formed a consortium in February 2026. The new specifications support capacities up to 512GB through eight-high and sixteen-high NAND stacks. They also define three bandwidth grades ranging from about 0.4TB per second to 3.0TB per second.
Open Standard Expands Processor Compatibility
The specification uses Universal Chiplet Interconnect Express to connect High Bandwidth Flash with processors. This interface supports integration with several processor types, including graphics processors and central processing units. As a result, system designers can add the technology across different hardware platforms.
The standard also covers electrical features, connection methods, reliability requirements, packaging rules, and software input-output guidance. SK hynix and Sandisk published the specification through the Open Compute Project. That release makes the framework available for wider industry use instead of limiting it to one vendor.
Google and Tenstorrent already participate in the High Bandwidth Flash consortium. Meanwhile, the group plans to add more members and improve technical maturity. Broader participation could help suppliers align products around common performance and compatibility requirements.
SK hynix Showcases Advanced NAND Products
SK hynix also introduced its tenth-generation 375-layer 4D NAND wafer during FMS 2026. The product remains under development and delivers higher efficiency than the previous generation. The company said performance per watt improves by 2.5 times.
The new NAND targets data centers that require stronger performance and lower power use. SK hynix plans to begin mass production of related enterprise solid-state drives early next year. The rollout could strengthen its position in high-capacity storage for advanced computing systems.
The company also presented products for mobile devices, personal computers, vehicles, and robotics. In addition, executives outlined a tiered memory architecture combining several memory technologies within one system. SK hynix will use the event to promote wider adoption of High Bandwidth Flash across storage markets.
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